470pF50V. 471K50. CS3216C0G471K500NR. Size:3216(1206). NP0 (C0G). MLCC. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서

Item		MLCC-3216-broken

Description		Size:3216(1206). 471K 50V. 470pF 50V-10%. NP0 (C0G). Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서

Vendor		SAMWHA

D/C		n/a

Part No.		CS3216C0G471K500NR. 470pF50V. 471K50

Q'ty		3800 EA

Remark		broken reel

Item		MLCC-3216-broken

Description		Size:3216(1206). 471K 50V. 470pF 50V-10%. NP0 (C0G). Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서

Vendor		SAMHWA

D/C		n/a

Part No.		CS3216C0G471K500NR. 470pF50V. 471K50

Q'ty		3500 EA

Remark		broken reel

10uF10V-10%. 106K10V. LMK325BJ106KN-T. Size:3225(1210). MLCC. X7R. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 (0)	2020.04.03
22nF50V. 22000pF50V. 0.022uF50V. 223K50V. CS3216X7R223K500NR. Size:3216(1206). MLCC. X7R. Multilayer Ceramic Chip Capacitor. 칩세라믹콘덴서 (0)	2020.04.03
10uF16V. 106Z16V. GRM235Y5V106Z16T641. Size:3225(1210). MLCC. MONOLITHIC CHIP CAPACITOR. 모노리틱 콘덴서. 모노콘덴서 (0)	2020.04.02
3225(1210). 3216(1206). 2012(0805). 1608(0603). 1005(0402) MLCC. SMD/CHIP CERAMIC CAPACITOR. CHIP RESISTOR. 칩세라믹콘덴서. 칩저항. 동환전자 (0)	2017.11.01
100PF25V-M. 100PF 25V-20%. EZANCE101M. C101. Chip 3-Terminal Capacitor Array. 칩 캐패시터 에레이. 칩 세라믹 콘덴서 어레이. 동환전자. DongHwa (0)	2016.10.25

동환전자(DongHwan Electronics)