TMK325F106ZH-T. 10UF25V-Z. 10UF 25V-+80 -20%. 106Z 25V. Size:3225. MLCC. Chip Cermic Capacitor. 칩세라믹 콘덴서. 동환전자. DongHwan Electron

Item		MLCC-3225

Description		Size:3225. 10UF 25V-+80 -20%. 106Z 25V. Chip Cermic Capacitor. 칩세라믹 콘덴서.

Vendor		TAIYO YUDEN

D/C		00+

Part No.		TMK325F106ZH-T. 10UF25V-Z

Q'ty		4000 EA

Remark		reel 2000 pcs

2012 Y5V 0.1uF. 104Z50V. 0.1uF50V. 100nF50V +80~–20%. Size:2012 (0805). CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 칩세라믹컨덴서. MLCC. 동환 (0)	2017.12.05
CL32B475KBUYNNE. 4.7uF50V-K. MLCC-SMD/CHIP CERAMIC CAPACITOR. 칩세라믹 콘덴서. SMD 칩세라믹 커패시터. 동환전자. DongHwan Electronics (0)	2016.12.15
2PF 50V-±0.25pF. 2PF50V-C. C2012CH1H020CT000A. 020C 50V. MLCC-2012-Chip Ceramic Capacitor. 칩 세라믹 콘덴서. 동환전자. DongHwan Electronics (0)	2016.11.01
CL10C470JB8NNNC. 47PF50V-J. 470J50V. 47PF 50V-5%. Chip Ceramic Capacitor. 칩세라믹 콘덴서. 칩 세라믹 캐퍼시터 (캐패시터). 동환전자. DongHwan (0)	2016.07.29
C1812C394K5RAC-7800. 390nF50V-K. 0.39UF50V-K. Size:4532(1812). Chip Ceramic Capacitor. KEMET. 칩세라믹 콘덴서/커패시터 (0)	2015.11.18

동환전자(DongHwan Electronics)