CCP2B25TE. Size:3216. 2.5A 24V (24V 2.5A). Marking:25. SMD/CHIP MICRO FUSE. 칩마이크로휴즈 / 칩마이크로퓨즈. 동환전자. DongHwan Electronics

Item		SMD/CHIP MICRO FUSE. 칩 마이크로 휴즈 /칩 마이크로 퓨즈

Description		Size:3216. 2.5A 24V (24V 2.5A). CHIP MICRO FUSE Marking Code:25

Vendor		KOA

D/C		01+

Part No.		CCP2B25TE

Q'ty		5500 EA

Remark		reel 3000pcs

25NM-32V-5A. 25NM-32V5A. Size:6320. 32V 5A. SMD SURFACE MOUNT MICRO FUSE. 칩 마이크로 휴즈/퓨즈. 동환전자. DongHwan Electronics (0)	2014.03.04
CCP2E35TE. Size:3225(1210). 3.5A 72V (72V 3.5A). Marking Code:35. SMD/CHIP MICRO FUSE. 칩 마이크로 휴즈 / 칩 마이크로 퓨즈. 동환전자. (0)	2014.02.07
R460004. Size:7.24x4.32mm. 4A 125V. (125V 4A). Slow-Blow Type. PICO FUSE-SMF. SMD/CHIP FUSE. 칩휴즈 / 칩퓨즈. 동환전자. DongHwan Electronics (0)	2014.02.06
SSQ-1.5A125V. 125V1.5A. Square Ceramic Surface Mount Quick Acting Fuse. SMD/CHIP FUSE. 칩세라믹 휴즈/퓨즈. 동환전자. DongHwan Electronics (0)	2013.12.12
SSQ-1A125V-T&R. 125V1A. Square Ceramic Surface Mount Quick Acting Fuse. SMD/CHIP FUSE. 칩세라믹휴즈/퓨즈. 동환전자. DongHwan Electronics (0)	2013.12.12

동환전자(DongHwan Electronics)