CL31B152KBNC. 152K50V. Size:3216(1206). X7R. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electronics

Item		MLCC. SMD/CHIP CERAMIC CAPACITOR

Description		Size:3216(1206). 1.5nF 50V-10%. 1500pF 50V-10%. 0.0015uF 50V. 152K 50V. CHIP CERAMIC CAPACITOR

Vendor		SAMSUNG

D/C		01+

Part No.		CL31B152KBNC. CL31B152KBNCS. 1.5nF50V. 1500pF50V-K. 0.0015uF50V. 152K50V

Q'ty		3700 EA

Remark		broken reel

2.2nF50V. 2200pF50V. 0.0022uF50V. 222K50V. MC13B222K50VV. X7R. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electron (0)	2019.11.07
1.5nF50V. 1500pF50V. 0.0015uF50V. 152K50V. 3216(1206). X7R. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electronics (0)	2019.11.07
2.7nF50V. 2700pF50V. 0.0027uF50V. 272K50V. 2012(0805). X7R. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electronics (0)	2019.11.07
CL21B272KBNC. 272K50V. Size:2012(0805). X7R. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electronics (0)	2019.11.07
100pF50V. 101J50V. Size:1005(0402). 100pF 50V-5%. MLCC. SMD/CHIP CERAMIC CAPACITOR. 칩세라믹콘덴서. 동환전자. DongHwan Electronics (0)	2019.11.06

동환전자(DongHwan Electronics)